IEC/TR 61760-5-1 Ed. 1.0:2024 (en)
表面実装技術-第5-1部:基板の表面ひずみ-チップ部品のひずみゲージ測定
Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
発行年月日:
2024-01-31
状態:
有効
邦訳版:
無
英語 24ページ
29,700 円(税込) 本体価格:27,000円
規格概要 | IEC TR 61760-5-1:2024 describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called bending cracks . Area-array components are excluded from the scope of this document. |
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TC |
TC 91 |
ICS |
31.190 |
備考 |