NEWS TOPICS

会員向け情報

規格・書籍・物品

詳細検索する

IEC 63378-2-1 Ed. 1.0:2024 (en)
半導体パッケージの熱標準化-第2-1部:定常解析のための半導体パッケージの3D熱シミュレーションモデル-個別パッケージ
Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages

発行年月日: 2024-10-22
状態: 有効
邦訳版: 無

規格概要
IEC 63378-2-1:2024 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately.
This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.
全文を表示する
TC TC 47/SC 47D
ICS 31.080.01
備考
LOADING...