IEC 62769-7 Ed. 3.0:2023 (b)
フィールドデバイス統合(FDI)-第7部:FDIコミュニケーションデバイス
Field Device Integration (FDI ) - Part 7: Communication Devices
発行年月日:
2023-04-06
状態:
有効
邦訳版:
無
英語 130ページ
70,262 円(税込) 本体価格:63,875円
- 規格概要
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IEC 62769-7:2023 is available as IEC 62769-7:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-7:2023 specifies the elements implementing communication capabilities called Communication Devices. The overall FDI 1 architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this illustration. The document scope with respect to FDI Packages is limited to Communication Devices. The Communication Server shown in Figure 1 is an example of a specific Communication Device.全文を表示する
1 FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.
TC |
TC 65/SC 65E |
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ICS |
35.100.05 |
備考 |