IEC 62769-6 Ed. 3.0:2023 (b)
フィールドデバイス統合(FDI)-第6部:FDIテクノロジマッピング
Field Device Integration (FDI ) - Part 6: FDI Technology Mappings
発行年月日:
2023-04-06
状態:
有効
邦訳版:
無
英語 14ページ
3,850 円(税込) 本体価格:3,500円
- 規格概要
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IEC 62769-6:2023 is available as IEC 62769-6:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-6:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI 1) standard. The technology mapping focuses on implementation of the components FDI Client and User Interface Plug-in (UIP) in the specified technologies for the WORKSTATION platform and the MOBILE platform as defined in IEC 62769-4. There are individual subparts for the currently supported technologies .NET and HTML5.全文を表示する
TC |
TC 65/SC 65E |
---|---|
ICS |
35.100.05 |
備考 |