IEC 62769-4 Ed. 3.0:2023 (b)
フィールドデバイス統合(FDI)-第4部:FDIパッケージ
Field Device Integration (FDI ) - Part 4: FDI Packages
発行年月日:
2023-04-05
状態:
有効
邦訳版:
無
英語 181ページ
74,112 円(税込) 本体価格:67,375円
- 規格概要
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IEC 62769-4:2023 is available as IEC 62769-4:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-4:2023 specifies the FDI 1 Packages. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Architecture diagram figure.全文を表示する
1 FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.
TC |
TC 65/SC 65E |
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ICS |
35.100.05 |
備考 |