NEWS TOPICS

会員向け情報はこちら

規格・書籍・物品

詳細検索する

IEC 62047-38 Ed. 1.0:2021 (en)
半導体素子-超小型電気機械素子-第38部:MEMS相互接続における金属粉末ペーストの接着強度の試験方法
Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection

発行年月日: 2021-06-23
状態: 有効
邦訳版: 無

規格概要 IEC 62047-38:2021(E) specifies a test method for measuring the adhesion strength of metal powder paste in the electrical interconnection between micro-electromechanical systems (MEMS) and a circuit board. The typical examples of metal powder paste are anisotropic conductive paste, solder paste, and nanoscale metallic inks. This testing method is valid for metal powder diameters from 10 m and 500 m.
In this test method, a uniaxial compression load is applied to metal powder paste using a glass lens simulating an actual MEMS device; then, the adhesion strength is measured by retracting the lens. This test method is proper when the adhesion strength should be analyzed by considering the actual contact area between the MEMS device and metal powder particles.
TC TC 47/SC 47F
ICS 31.080.99
備考
LOADING...