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IEC 61249-2-51 Ed. 1.0:2023 (b)
プリント板及びその他の相互接続構造体の材料-第2-51部:被覆及び無被覆強化基板-集積回路カードキャリアテープ用基材,アンクラッド
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad

発行年月日: 2023-05-11
状態: 有効
邦訳版: 無

規格概要
IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials).
This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.
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TC TC 91
ICS 31.180
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