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IEC 61189-2-720 Ed. 1.0:2024 (b)
電気材料,回路基板.その他の相互接続構造およびアセンブリの試験方法-第2-720部:静電容量の測定による相互接続構造の欠陥の検出
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance

発行年月日: 2024-03-06
状態: 有効
邦訳版: 無

規格概要 IEC 61189-2-720:2024 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.
TC TC 91
ICS 31.180
備考
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