IEC 61189-2-720 Ed. 1.0:2024 (b)
電気材料,回路基板.その他の相互接続構造およびアセンブリの試験方法-第2-720部:静電容量の測定による相互接続構造の欠陥の検出
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
発行年月日:
2024-03-06
状態:
有効
邦訳版:
無
英語 21ページ
7,700 円(税込) 本体価格:7,000円
- 規格概要
-
IEC 61189-2-720:2024 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.全文を表示する
TC |
TC 91 |
---|---|
ICS |
31.180 |
備考 |