IEC 60749-39 Ed. 2.0:2021 (b)
半導体素子-機械及び耐候試験方法-第39部:半導体部品に使用する有機素材の水分拡散率及び水溶性の測定
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
発行年月日:
2021-11-29
状態:
有効
邦訳版:
無
英語 25ページ
15,400 円(税込) 本体価格:14,000円
- 規格概要
-
IEC 60749-39:2021 is available as IEC 60749-39:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-39:2021 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow. This edition includes the following significant technical changes with respect to the previous edition:全文を表示する
- updated procedure for ""dry weight"" determination.
TC |
TC 47 |
---|---|
ICS |
31.080.01 |
備考 |