IEC 60749-37 Ed. 2.0:2022 RLV (Redline version) (b)
半導体素子－機械及び耐候試験方法－第37部：加速度計を使用するボードレベル落下試験方法
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
発行年月日：
2022-10-12
状態：
有効
邦訳版：
無
英語 67ページ
50,820 円（税込） 本体価格：46,200円
- 規格概要
-
IEC 60749-37:2022 is available as IEC 60749-37:2022 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition:全文を表示する
- correction of a previous technical error concerning test conditions;
- updates to reflect improvements in technology.
| TC |
TC 47 |
|---|---|
| ICS |
31.080.01 |
| 備考 | Redlineについてはこちら |
