IEC/TR 62878-2-9 Ed. 1.0:2022 (en)
デバイス埋め込みアセンブリテクノロジー-第2-9部:指針-電子組立技術産業におけるJISSOレベルの概念
Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
発行年月日:
2022-04-27
状態:
有効
邦訳版:
無
英語 15ページ
15,400 円(税込) 本体価格:14,000円
- 規格概要
-
IEC TR 62878-2-9:2022(E) comprises the long-term discussion among Jisso International Council (JIC) members during 1999 and 2005, when the interim agreement among all JIC members about the concept of Jisso as well as the Jisso product level for the common understanding on IEC TC 91 (electronic assembly technology) activities was reached. Further discussion on Jisso Product Level could be needed among the current JIC members to finalize it in the near future based on this technical report.全文を表示する
TC |
TC 91 |
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ICS |
31.190 |
備考 |