IEC 62047-46 Ed. 1.0:2025 (en)
半導体素子－超小型電気機械素子－第46部：シリコンベースMEMS製造技術－ナノスケール厚さ膜の引張強度測定方法
Semiconductor devices - Micro-electromechanical devices - Part 46: Silicon based MEMS fabrication technology - Measurement method of tensile strength of nanoscale thickness membrane
発行年月日：
2025-04-23
状態：
有効
邦訳版：
無
英語 15ページ
15,400 円（税込） 本体価格：14,000円
- 規格概要
-
IEC 62047-46:2025 specifies the requirements and testing method to measure the tensile strength of membrane with nanoscale thickness (length from 100 m to 5 000 m, width from 100 m to 1 000 m, thickness from 50 nm to 500 nm) which is fabricated by micromachining technology used in silicon-based micro-electromechanical system (MEMS).全文を表示する
This document is applicable to in-situ tensile strength measurement of nanoscale thickness membrane manufactured by microelectronics technology and related micromachining technology.
With the devices scaling, the tensile strength degradation, induced by defects and contaminations, becomes severer. This document specifies an in-situ testing method of the tensile strength of membrane with nanoscale thickness based on a MEMS technique. This document does not need intricate instruments (such as scanning probe microscopy and nanoindenter) and special test specimens.
Since in-situ on-chip tester in this document and device are fabricated with the same process on the same wafer, this document can give some practical reference for the design part.
| TC |
TC 47/SC 47F |
|---|---|
| ICS |
31.080.99 |
| 備考 |
