IEC 61837-2 Ed. 3.2:2026 (en)
周波数制御及び選択のための表面実装圧電装置-標準外形及び端子リード接続-第2部:セラミックエンクロージャ
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures
発行年月日:
2026-06-18
状態:
有効
邦訳版:
無
英語 228ページ
236,775 円(税込) 本体価格:215,250円
- 規格概要
-
IEC 61837-2:2018+AMD1:2020+AMD2:2026 CSV deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016. This edition includes the following significant technical changes with respect to the previous edition:全文を表示する
- revision of the figures to match the notation of the drawings of IEC 61240:2016;
- addition of 7 enclosures as follows: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C.
As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1.
| TC |
TC 49 |
|---|---|
| ICS |
31.140 |
| 備考 |