IEC 61189-2-808 Ed. 1.0:2024 (b)
電気材料,プリント板及びその他の相互接続構体並びにアセンブリの試験方法-第2-808部:過渡熱法によるアセンブリの熱抵抗
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
発行年月日:
2024-04-25
状態:
有効
邦訳版:
無
英語 40ページ
22,770 円(税込) 本体価格:20,700円
規格概要 | IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink. NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A. |
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TC |
TC 91 |
ICS |
31.180 |
備考 |