IEC 60749-23 Ed. 2.0:2025 RLV (Redline version) (en)
半導体素子－機械及び耐候試験方法－第23部：高温動作寿命
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
発行年月日：
2025-12-09
状態：
有効
邦訳版：
無
英語 29ページ
15,334 円（税込） 本体価格：13,940円
- 規格概要
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IEC 60749-23:2025 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.全文を表示する
IEC 60749-23:2025 specifies the test used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as burn-in, can be used to screen for infant-mortality related failures. The detailed use and application of burn-in is outside the scope of this document.
This edition includes the following significant technical changes with respect to the previous edition:
a) absolute stress test definitions and resultant test durations have been updated.
| TC |
TC 47 |
|---|---|
| ICS |
31.080.01 |
| 備考 | Redline版に関する説明 |
