IEC 60749-21 Ed. 3.0:2025 (b)
半導体素子－機械及び耐候試験方法－第21部：はんだ付け性
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
発行年月日：
2025-12-09
状態：
有効
邦訳版：
無
英語 41ページ
36,080 円（税込） 本体価格：32,800円
- 規格概要
-
IEC 60749-21:2025 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment. This test method provides a procedure for dip and look solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. The test method also provides optional conditions for ageing. This test is considered destructive unless otherwise detailed in the relevant specification.全文を表示する
NOTE 1 This test method does not assess the effect of thermal stresses which can occur during the soldering process. More details can be found in IEC 60749 15 or IEC 60749 20.
NOTE 2 If a qualitative test method is preferred, the Wetting balance test method can be found in IEC 60068-2-69.
This edition includes the following significant technical changes with respect to the previous edition:
- revision to certain operating conditions in line with current working practices.
| TC |
TC 47 |
|---|---|
| ICS |
31.080.01 |
| 備考 |
