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IEC 60317-35 Ed. 2.2:2024 (en)
特定の種類の巻線の仕様-第35部:はんだ付け可能なポリウレタンエナメル丸銅線,クラス155,融着層付き
Specifications for particular types of winding wires - Part 35: Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer

発行年月日: 2024-06-14
状態: 有効
邦訳版: 無

規格概要 IEC 60317-35:2013+AMD1:2019+AMD2:2024 CSV specifies the requirements of solderable enamelled round copper winding wire of class 155 with a dual coating. The underlying coating is based on poly-urethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin.
NOTE - A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is:
- Grade 1B: 0,020 mm up to and including 0,800 mm;
- Grade 2B: 0,020 mm up to and including 0,800 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This second edition cancels and replaces the first edition published in 1992, Amendment 1:1997 and Amendment 2:1999. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
- new 3.2.2 containing general notes on winding wire, formerly a part of the scope;
- revision to references to IEC 60317-0-1:2013 to clarify that their application is normative;
- modification to Clause 15 to remove specific wire specimen sizes;
- consolidation of 17.1 and 17.2 of the solderability requirements;
- new Clause 23, Pin hole test.

Key words: requirements of solderable enamelled round copper winding wire, class 155, dual coating
TC TC 55
ICS 29.060.10
備考
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