NEWS TOPICS

会員向け情報

規格・書籍・物品

詳細検索する

IEC 60068-2-83 Ed. 2.0:2025 RLV (Redline version) (en)
環境試験-第2-83部:試験-試験Tf:はんだペーストを用いるウェッティングバランス法による表面実装素子(SMD)の電子部品のはんだ性試験
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

発行年月日: 2025-05-27
状態: 有効
邦訳版: 無

規格概要
IEC 60068-2-83:2025 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.

IEC 60068-2-83:2025 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder paste. Data obtained by these methods are not intended to be used as absolute quantitative data for pass/fail purposes.
NOTE Different solderability test methods for SMD are described in IEC 60068 2 58 and IEC 60068 2 69. IEC 60068 2 58 specifies visual evaluation using solder bath and reflow method, IEC 60068 2 69 specifies wetting balance evaluation using solder bath and solder globule method.
This edition includes the following significant technical change with respect to the previous edition:
a) revise Clause 5 to align with that in IEC 60068 2 20:2021.
全文を表示する
TC TC 91
ICS 31.190
備考 Redline版に関する説明
LOADING...