JEITA EDR-7340
Thermal conductivity measurement guideline for semiconductor packaging materials "Molding resin"
Date Published:
2024-11-01
Status:
Valid
Japanese:
Japanese 23pages
JPY 6,600 ( JPY 6,600excl. tax )
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- Standard Abstract
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This technical report is about the thermal conductivity measurement guideline for semiconductor packaging materials "Molding resin".More
| ICS | |
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| Corresponding Standards |
Explanation of Equivalency
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| Referenced JIS Stantards | |
| Referenced Stantards | |
| Remarks |