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JEITA EDR-7326A
Design guideline of integrated circuits for Plastic Small Outline Package with Heat sink (P-HSOP)

Date Published: 2002-03-01
Status: Valid
Japanese:

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Standard Abstract
This technical report is about the design guideline of integrated circuits for plastic small outline package with heat sink (P-HSOP).
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Corresponding Standards
Referenced JIS Stantards
Referenced Stantards
Remarks Former No. ED-7415 EDR-7326
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