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JEITA EDR-4712/500
Non-destructive recognition procedures of defects in Silicon Carbide Wafers (Part 5: The measurement method for defects in Silicon Carbide Wafer by X-ray topography)

Date Published: 2023-04-01
Status: Valid
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Standard Abstract
This technical report is about the non-destructive recognition procedures of defects in silicon carbide wafers (Part 5: The measurement method for defects in silicon carbide wafer by X-ray topography).
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