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JEITA EDR-4712/200
Non-destructive recognition procedures of defects in Silicon Carbide Wafers (Part 2: The measurement method for defects in Silicon Carbide Wafer by optical inspection)

Date Published: 2017-02-01
Status: Valid
Japanese:

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Standard Abstract
This technical report is about the non-destructive recognition procedures of defects in silicon carbide wafers (Part 2: The measurement method for defects in silicon carbide wafer by optical inspection).
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Referenced JIS Stantards
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Remarks This standard is written in both Japanese and English.
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